Invention Grant
- Patent Title: Printed circuit board for improving tolerance of embedded capacitors, and method of manufacturing the same
- Patent Title (中): 用于提高嵌入式电容器容差的印刷电路板及其制造方法
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Application No.: US11797084Application Date: 2007-04-30
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Publication No.: US08022311B2Publication Date: 2011-09-20
- Inventor: Tae Eui Kim , Byoung Youl Min , Myung Sam Kang , Je Gwang Yoo
- Applicant: Tae Eui Kim , Byoung Youl Min , Myung Sam Kang , Je Gwang Yoo
- Applicant Address: KR Suwon
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon
- Priority: KR10-2007-0020958 20070302
- Main IPC: H05K1/16
- IPC: H05K1/16

Abstract:
Disclosed are a printed circuit board for improving the tolerance of embedded capacitors and a method of manufacturing the same. The printed circuit board having embedded capacitors is manufactured by transferring and embedding a circuit layer having a lower electrode formed through an additive process into a resin insulating layer, and thereby is minimized in the circuit tolerance conventionally caused by an etching process to thus be applied to capacitors for RF matching.
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