A substrate structure capable of miniaturizing and thinning a housing of a portable terminal is provided.A substrate structure 10 comprises a substrate 11, plural electronic components 12 mounted along one mounting surface 11A in the substrate 11, and a resin part 13 for making close contact with the mounting surface 11A of the substrate 11while each of the electronic components 12 is covered with a resin 13A. In the substrate structure 10, a through hole 14 extending through the substrate 11 in a thickness direction is disposed and also the side of the mounting surface 11A in the through hole 14 is closed by a lid member 15. A rising part 21 is disposed in a peripheral part of this lid member 15.