Invention Grant
- Patent Title: Circuit board with electromagnetic bandgap adjacent or overlapping differential signals
- Patent Title (中): 电路板与电磁带隙相邻或重叠差分信号
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Application No.: US12346655Application Date: 2008-12-30
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Publication No.: US08022313B2Publication Date: 2011-09-20
- Inventor: Jun-Ho Lee
- Applicant: Jun-Ho Lee
- Applicant Address: KR
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR
- Agency: Baker & McKenzie LLP
- Priority: KR10-2008-0035229 20080416
- Main IPC: H05K1/16
- IPC: H05K1/16
Abstract:
A circuit board includes a plurality of differential signal line pairs, and a plurality of electromagnetic bandgap (EBG) patterns, each configured to be disposed to overlap the plurality of differential signal line pairs, wherein the EBG patterns are electrically insulated from the differential signal line pairs.
Public/Granted literature
- US20090260864A1 CIRCUIT BOARD AND SEMICONDUCTOR INTEGRATED CIRCUIT MODULE INCLUDING THE SAME Public/Granted day:2009-10-22
Information query
