发明授权
- 专利标题： Semiconductor wafer
- 专利标题（中）： 半导体晶圆
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申请号： US11873436申请日： 2007-10-17
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公开(公告)号： US08022508B2公开(公告)日： 2011-09-20
- 发明人: Keiji Miki
- 申请人： Keiji Miki
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Steptoe & Johnson LLP
- 优先权： JP2006-284438 20061019; JP2007-232114 20070907
- 主分类号： H01L23/544
- IPC分类号： H01L23/544
摘要：
A semiconductor wafer 10 has a plurality of semiconductor chip areas 10a and a scribe area 10b, each of the semiconductor chip areas 10a having semiconductor elements and electrode pads (electrode portions) 16a electrically connected to the respective semiconductor elements, the scribe area 10b having monitor elements and electrode pads (electrode portions) 16b electrically connected to the monitor elements, wherein projecting electrodes 18 are selectively formed only on the respective electrode pads 16a in the semiconductor chip areas 10a by electroless plating. Thus, for example, the electrode pads 16b are covered with an insulating film 14.
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