发明授权
US08022518B2 Semiconductor device having a sealing body and partially exposed conductors
有权
半导体器件具有密封体和部分露出的导体
- 专利标题： Semiconductor device having a sealing body and partially exposed conductors
- 专利标题（中）： 半导体器件具有密封体和部分露出的导体
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申请号： US12759008申请日： 2010-04-13
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公开(公告)号： US08022518B2公开(公告)日： 2011-09-20
- 发明人: Yukihiro Satou , Takeshi Otani , Hiroyuki Takahashi , Toshiyuki Hata , Ichio Shimizu
- 申请人： Yukihiro Satou , Takeshi Otani , Hiroyuki Takahashi , Toshiyuki Hata , Ichio Shimizu
- 申请人地址： JP Kanagawa
- 专利权人： Renesas Electronics Corporation
- 当前专利权人： Renesas Electronics Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： Mattingly & Malur, P.C.
- 优先权： JP2003-054638 20030228
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.