Invention Grant
US08029968B2 Positive resist composition and method for resist pattern formation
有权
抗蚀剂图案形成的正型抗蚀剂组成和方法
- Patent Title: Positive resist composition and method for resist pattern formation
- Patent Title (中): 抗蚀剂图案形成的正型抗蚀剂组成和方法
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Application No.: US11570399Application Date: 2005-06-17
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Publication No.: US08029968B2Publication Date: 2011-10-04
- Inventor: Ryotaro Hayashi , Satoshi Yamada , Makiko Irie
- Applicant: Ryotaro Hayashi , Satoshi Yamada , Makiko Irie
- Applicant Address: JP Kawasaki-shi
- Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee: Tokyo Ohka Kogyo Co., Ltd.
- Current Assignee Address: JP Kawasaki-shi
- Agency: Knobbe Martens Olson & Bear LLP
- Priority: JP2004-196567 20040702
- International Application: PCT/JP2005/011148 WO 20050617
- International Announcement: WO2006/003800 WO 20060112
- Main IPC: G03F7/004
- IPC: G03F7/004 ; G03F7/30

Abstract:
A positive resist composition with a broad DOF and a method for resist pattern formation are provided. This composition is a positive resist composition which includes a resin component (A) that exhibits increased alkali solubility under the action of acid and an acid generator component (B) that generates acid upon exposure, wherein the component (A) is a copolymer that contains n [wherein, n is an integer from 4 to 6] structural units with mutually different structures, and the proportion of each structural unit within the copolymer is greater than 0 mol % but no higher than 100/(n−1) mol %.
Public/Granted literature
- US20080268375A1 Positive Resist Composition and Method for Resist Pattern Formation Public/Granted day:2008-10-30
Information query
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