发明授权
- 专利标题: SOI substrate and manufacturing method thereof
- 专利标题(中): SOI衬底及其制造方法
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申请号: US12497720申请日: 2009-07-06
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公开(公告)号: US08030169B2公开(公告)日: 2011-10-04
- 发明人: Tetsuya Kakehata , Hideto Ohnuma , Yoshiaki Yamamoto , Kenichiro Makino
- 申请人: Tetsuya Kakehata , Hideto Ohnuma , Yoshiaki Yamamoto , Kenichiro Makino
- 申请人地址: JP Atsugi-shi, Kanagawa-ken
- 专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人: Semiconductor Energy Laboratory Co., Ltd.
- 当前专利权人地址: JP Atsugi-shi, Kanagawa-ken
- 代理机构: Robinson Intellectual Property Law Office, P.C.
- 代理商 Eric J. Robinson
- 优先权: JP2008-178027 20080708
- 主分类号: H01L21/762
- IPC分类号: H01L21/762
摘要:
An object is to provide an SOI substrate provided with a semiconductor layer which can be used practically even when a glass substrate is used as a base substrate. Another object is to provide a semiconductor device having high reliability using such an SOI substrate. An altered layer is formed on at least one surface of a glass substrate used as a base substrate of an SOI substrate to form the SOI substrate. The altered layer is formed on at least the one surface of the glass substrate by cleaning the glass substrate with solution including hydrochloric acid, sulfuric acid or nitric acid. The altered layer has a higher proportion of silicon oxide in its composition and a lower density than the glass substrate.
公开/授权文献
- US20100006940A1 SOI SUBSTRATE AND MANUFACTURING METHOD THEREOF 公开/授权日:2010-01-14
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