Invention Grant
- Patent Title: Contact barrier structure and manufacturing methods
- Patent Title (中): 接触屏障结构及制造方法
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Application No.: US12722247Application Date: 2010-03-11
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Publication No.: US08030210B2Publication Date: 2011-10-04
- Inventor: Ching-Ya Wang , Chung-Hu Ke , Wen-Chin Lee
- Applicant: Ching-Ya Wang , Chung-Hu Ke , Wen-Chin Lee
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/3205
- IPC: H01L21/3205

Abstract:
A semiconductor structure includes a semiconductor substrate; a gate dielectric over the semiconductor substrate; a gate electrode over the gate dielectric; a source/drain region adjacent the gate dielectric; a silicide region on the source/drain region; a metal layer on top of, and physical contacting, the silicide region; an inter-layer dielectric (ILD) over the metal layer; and a contact opening in the ILD. The metal layer is exposed through the contact opening. The metal layer further extends under the ILD. The semiconductor structure further includes a contact in the contact opening.
Public/Granted literature
- US20100167485A1 Contact Barrier Structure and Manufacturing Methods Public/Granted day:2010-07-01
Information query
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