发明授权
- 专利标题: Method of manufacturing a hydrogen separation substrate
- 专利标题(中): 氢分离基板的制造方法
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申请号: US11579115申请日: 2005-08-15
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公开(公告)号: US08030600B2公开(公告)日: 2011-10-04
- 发明人: Kenji Kimura
- 申请人: Kenji Kimura
- 申请人地址: JP Toyota
- 专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人: Toyota Jidosha Kabushiki Kaisha
- 当前专利权人地址: JP Toyota
- 代理机构: Oliff & Berridge, PLC
- 优先权: JP2004-237991 20040818
- 国际申请: PCT/JP2005/015176 WO 20050815
- 国际公布: WO2006/019168 WO 20060223
- 主分类号: B23K13/01
- IPC分类号: B23K13/01 ; B01D59/12 ; B01D53/22 ; B03C1/00
摘要:
The hydrogen permeable substrate includes a copper plate, a stainless steel plate, an insulating member, and hydrogen permeable metal. The hydrogen permeable substrate is formed by locating the insulating member between the stainless steel plate and a combined member formed by embedding the hydrogen permeable metal in through-holes made in the copper plate; subjecting the joining face of each component for joining to other components to irradiation with argon ions, to remove the oxide film thereon and activate the surface; and stacking and rolling the components. By so doing, they may be joined at low temperature and low pressure. Once joined, by cutting the hydrogen permeable metal into individual pieces along cut lines, a plurality of hydrogen permeable substrates may be manufactured all at once.
公开/授权文献
- US20070215604A1 Method of Manufacturing a Hydrogen Separation Substrate 公开/授权日:2007-09-20