Invention Grant
- Patent Title: Integrated circuit package system with a heat sink
- Patent Title (中): 具有散热片的集成电路封装系统
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Application No.: US11307532Application Date: 2006-02-10
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Publication No.: US08030755B2Publication Date: 2011-10-04
- Inventor: Sangkwon Lee , Tae Keun Lee
- Applicant: Sangkwon Lee , Tae Keun Lee
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agent Mikio Ishimaru
- Main IPC: H01L23/10
- IPC: H01L23/10
Abstract:
An integrated circuit package system is provided forming a substrate having an integrated circuit die thereon, thermally connecting a heat slug and a resilient thermal structure to the integrated circuit die, and encapsulating the resilient thermal structure.
Public/Granted literature
- US20070108587A1 INTEGRATED CIRCUIT PACKAGE SYSTEM WITH A HEAT SINK Public/Granted day:2007-05-17
Information query
IPC分类:
