Invention Grant
- Patent Title: Imaging assembly
- Patent Title (中): 成像组件
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Application No.: US11201555Application Date: 2005-08-11
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Publication No.: US08031407B2Publication Date: 2011-10-04
- Inventor: Jonathan Ephriam David Hurwitz , Ewan Findlay
- Applicant: Jonathan Ephriam David Hurwitz , Ewan Findlay
- Applicant Address: GB Marlow-Buckinghamshire
- Assignee: STMicroelectronics Ltd.
- Current Assignee: STMicroelectronics Ltd.
- Current Assignee Address: GB Marlow-Buckinghamshire
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Agent Lisa K. Jorgenson
- Priority: EP04254868 20040813
- Main IPC: G02B1/00
- IPC: G02B1/00 ; G02B27/42 ; G02B27/00 ; G02B13/18
Abstract:
An imaging assembly for an image sensor may include a lens, a transparent substrate and two aspherical optical coatings on each side of the substrate. The imaging assembly can also incorporate an opaque coating with an opening in-line with the lens to form an aperture, an anti-reflection coating, and an infrared filter coating.
Public/Granted literature
- US20060033833A1 Imaging assembly Public/Granted day:2006-02-16
Information query
IPC分类:
| G | 物理 |
| G02 | 光学 |
| G02B | 光学元件、系统或仪器 |
| G02B1/00 | 按制造材料区分的光学元件；用于光学元件的光学涂层 |
