发明授权
- 专利标题: RFID tag mounting package and manufacturing method thereof
- 专利标题(中): RFID标签安装封装及其制造方法
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申请号: US12039453申请日: 2008-02-28
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公开(公告)号: US08035524B2公开(公告)日: 2011-10-11
- 发明人: Isao Sakama , Koichi Tachibana
- 申请人: Isao Sakama , Koichi Tachibana
- 申请人地址: JP Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Mattingly & Malur, PC
- 优先权: JP2007-193002 20070725
- 主分类号: G08B13/14
- IPC分类号: G08B13/14
摘要:
In an RFID tag mounting package mounted with an RFID tag and a manufacturing method thereof, in order to have sufficient communication performance without spoiling the design property of the package to which a conductive film is applied, a package is obtained by assembling a structural material in which a metallic film is formed on a base material made of paper or the like. In the package, a slot is provided in the metallic film of a folded portion, in a spot where portions (the folded portion and an external packaging portion) of the structural material overlap each other. An inlet operates as an RFID tag, includes an antenna and an IC chip connected to the antenna, and is mounted on the inner surface of the folded portion in conformity with the position of the slot.