发明授权
US08035978B2 Printed circuit board, fabrication method and apparatus 有权
印刷电路板,制造方法和装置

  • 专利标题: Printed circuit board, fabrication method and apparatus
  • 专利标题(中): 印刷电路板,制造方法和装置
  • 申请号: US12199489
    申请日: 2008-08-27
  • 公开(公告)号: US08035978B2
    公开(公告)日: 2011-10-11
  • 发明人: Shigeru Sugino
  • 申请人: Shigeru Sugino
  • 申请人地址: JP Kawasaki
  • 专利权人: Fujitsu Limited
  • 当前专利权人: Fujitsu Limited
  • 当前专利权人地址: JP Kawasaki
  • 代理机构: Staas & Halsey LLP
  • 优先权: JP2007-247319 20070925
  • 主分类号: H05K1/18
  • IPC分类号: H05K1/18
Printed circuit board, fabrication method and apparatus
摘要:
A printed circuit board includes a mounted a first electronic component. The printed circuit board includes a first through holes extending from a mounting surface on which the electronic component is mounted. The printed circuit board includes a second through holes extending from a surface opposite the mounting surface and aligned with the first through holes. A second electronic component may be longitudinally between the first through holes and the second through holes. The first and second through holes may be electrically connected with the second electronic component.
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