发明授权
- 专利标题: Apparatus for thermal characterization under non-uniform heat load
- 专利标题(中): 非均匀热负荷下热表征的装置
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申请号: US12048635申请日: 2008-03-14
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公开(公告)号: US08038343B2公开(公告)日: 2011-10-18
- 发明人: Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
- 申请人: Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Fleit Gibbons Gutman Bongini & Bianco PL
- 代理商 Jon A. Gibbons
- 主分类号: G01K3/00
- IPC分类号: G01K3/00
摘要:
A novel computer program product and method for thermally characterizing a device used for cooling an electronic device is disclosed. A cooling device, being operated, is thermally coupled to a heat pipe having a surface to receive a test chip. A heater is patterned on a circuitry side of the test chip. The heater is separate from operational circuitry of the test chip. A localized heat source is applied to at least one region on a test chip thermally coupled to the heat pipe to locally heat more than one region on a second surface of the test chip to test more than one hot spot. The second surface is the circuitry side of the test chip. The heater provides a bias heat to the test chip, independent of operating the test chip, while the localized heat source is selectively applied directly to the test chip. A temperature detector is used to measure a temperature distribution on the second surface of the test chip. The temperature distribution is used to thermally characterize said cooling device during operation.