发明授权
- 专利标题: Percutaneous instrument assembly
- 专利标题(中): 经皮仪器组装
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申请号: US11527246申请日: 2006-09-26
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公开(公告)号: US08038699B2公开(公告)日: 2011-10-18
- 发明人: Dan S. Cohen , Nicholas J. Bender , Oliver Buchert , Rui J. Ferreira
- 申请人: Dan S. Cohen , Nicholas J. Bender , Oliver Buchert , Rui J. Ferreira
- 申请人地址: US NJ Parsippany
- 专利权人: EBI, LLC
- 当前专利权人: EBI, LLC
- 当前专利权人地址: US NJ Parsippany
- 代理机构: Harness, Dickey
- 主分类号: A61B17/70
- IPC分类号: A61B17/70
摘要:
A percutaneous tower for the orthopedic procedures. The tower can include an outer elongated member, an inner elongated member received within the outer elongated member, a release actuator operable to move the inner elongated member relative to the outer elongated member between first and second positions, and a fastener engagement member coupled to a distal portion of the tower and operable to engage a bone fastener when the inner elongated member is in the first position, and to disengage the bone fastener when the inner elongated member is in the second position.
公开/授权文献
- US20080125788A1 Percutaneous instrument assembly 公开/授权日:2008-05-29