发明授权
- 专利标题： Circuit board, lead frame, semiconductor device, and method for fabricating the same
- 专利标题（中）： 电路板，引线框架，半导体器件及其制造方法
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申请号： US12423532申请日： 2009-04-14
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公开(公告)号： US08039941B2公开(公告)日： 2011-10-18
- 发明人: Takao Ochi
- 申请人： Takao Ochi
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2008-137093 20080526; JP2009-023474 20090204
- 主分类号： H01L23/06
- IPC分类号： H01L23/06
摘要：
A semiconductor device includes: an element mounting member including a first electrode; a semiconductor element mounted on the element mounting member and including a second electrode; and an interposer element mounted on the element mounting member with a first side of the interposer element facing one of a side of the semiconductor element. The interposer element is one of a triangle and a trapezoid in plan view, and includes: a first interposer electrode electrically connected to the second electrode via a first wire; a second interposer electrode electrically connected to the first electrode; and an internal interconnection electrically connecting the first interposer electrode and the second interposer electrode to each other.