发明授权
- 专利标题： Printed circuit board and method thereof and a solder ball land and method thereof
- 专利标题（中）： 印刷电路板及其方法和焊球地及其方法
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申请号： US12458429申请日： 2009-07-13
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公开(公告)号： US08039972B2公开(公告)日： 2011-10-18
- 发明人: Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
- 申请人： Ky-hyun Jung , Heui-seog Kim , Sang-jun Kim , Wha-su Sin , Ho-geon Song , Jun-young Ko
- 申请人地址： KR Gyeonggi-Do
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Gyeonggi-Do
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： KR10-2005-0073732 20050811
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/52 ; H01L29/40
摘要：
A printed circuit board and method thereof and a solder ball land and method thereof. The example printed circuit board (PCB) may include a first solder ball land having a first surface treatment portion configured for a first type of resistance and a second solder ball land having a second surface treatment portion configured for a second type of resistance. The example solder ball land may include a first surface treatment portion configured for a first type of resistance and a second surface treatment portion configured for a second type of resistance. A first example method may include first treating a first surface of a first solder ball land to increase a first type of resistance and second treating a second surface of a second solder ball land to increase a second type of resistance other than the first type of resistance. A second example method may include first treating a solder ball land to increase a first type of resistance and second treating the solder ball land to increase a second type of resistance other than the first type of resistance.
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