A method for manufacturing a solid electrolytic capacitor device is disclosed. The solid electrolytic capacitor device comprises a package substrate and a capacitor element which is mounted on the package substrate. The package substrate comprises an outer anode electrode, an outer cathode electrode, an inner anode electrode and an inner cathode electrode. The outer anode electrode is electrically connected to the inner anode electrode. The outer cathode electrode is electrically connected to the inner cathode electrode. The capacitor element comprises a capacitor body and an anode lead portion which extends from the capacitor body. The capacitor body has a surface at least one part of which is provided with a cathode portion. The method comprises: forming the anode lead portion; forming the cathode portion after the formation of the anode lead portion; and connecting the anode lead portion and the cathode portion to the inner anode electrode and the inner cathode electrode, respectively.