Invention Grant
- Patent Title: Method for electrically connecting to a contact of a microelectronic component on a circuit board or substrate
- Patent Title (中): 用于电连接到电路板或基板上的微电子部件的接触的方法
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Application No.: US11882824Application Date: 2007-08-06
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Publication No.: US08042724B2Publication Date: 2011-10-25
- Inventor: Andreas Ostmann , Alexander Neumann , Dionysios Manessis , Rainer Patzelt
- Applicant: Andreas Ostmann , Alexander Neumann , Dionysios Manessis , Rainer Patzelt
- Applicant Address: DE Munich DE Berlin
- Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.,Technische Universitaet Berlin
- Current Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.,Technische Universitaet Berlin
- Current Assignee Address: DE Munich DE Berlin
- Agency: Venable LLP
- Agent Robert Kinberg; Christopher Ma
- Priority: DE102006036728 20060805
- Main IPC: B23K31/00
- IPC: B23K31/00 ; H01L21/44
Abstract:
A method is provided for making an electrical connection with a microelectronic component arranged on or embedded within a surface of a circuit board layer or a substrate. The microelectronic component has an electrical contact face that is accessible on a surface of the microelectronic component. An electrically conducting bump is applied to the electrical contact face of the microelectronic component. A metal foil or metal coat is applied via a coating of an insulating binder to the surface of the circuit board under an action of pressure and/or heat so that the electrically conducting bump penetrates the coating of the insulating binder to make the electrical connection between the metal foil or metal coat and the electrical contact face.
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