Invention Grant
- Patent Title: Light emitting assembly with heat dissipation structure
- Patent Title (中): 具有散热结构的发光组件
-
Application No.: US11806945Application Date: 2007-06-05
-
Publication No.: US08042978B2Publication Date: 2011-10-25
- Inventor: Ming Lu , Chak Hau Charles Pang , Kai Chiu Adam Wu , Lei Shirley Shi
- Applicant: Ming Lu , Chak Hau Charles Pang , Kai Chiu Adam Wu , Lei Shirley Shi
- Applicant Address: HK Shatin
- Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
- Current Assignee: Hong Kong Applied Science and Technology Research Institute Company Limited
- Current Assignee Address: HK Shatin
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: HK07100217.0 20070105
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V21/26
Abstract:
A assembly includes at least a first and a second light emitting source for emission of light, and an air passage between the first and second light emitting sources to allow air flow therethrough for dissipation of heats generated by the light emitting sources.
Public/Granted literature
- US20080165546A1 Light emitting assembly Public/Granted day:2008-07-10
Information query
