Invention Grant
- Patent Title: Low transient and steady state thermal stress disk shaped components
- Patent Title (中): 低瞬态和稳态热应力盘形部件
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Application No.: US12031119Application Date: 2008-02-14
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Publication No.: US08043684B2Publication Date: 2011-10-25
- Inventor: Jun Shi
- Applicant: Jun Shi
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Bachman & LaPointe, P.C.
- Main IPC: B29C69/00
- IPC: B29C69/00 ; B32B9/04 ; H05B6/00

Abstract:
A process for manufacturing a disk shaped component comprising fabricating a disk shaped component using a composite material having at least a first material and a second material, wherein the first material is disposed at and proximate to a center portion of the disk shaped component and the second material is disposed at and proximate to a rim of the disk shaped component, wherein the first material comprises a first coefficient of thermal expansion, a first stress value and a first oxidation resistance, and the second material comprises a second coefficient of thermal expansion, a second stress value and a second oxidation resistance, wherein the first coefficient of thermal expansion is greater than the second coefficient of thermal expansion, the first stress value is greater than the second stress value and the first oxidation resistance is less than the second oxidation resistance.
Public/Granted literature
- US20090208752A1 LOW TRANSIENT AND STEADY STATE THERMAL STRESS DISK SHAPED COMPONENTS Public/Granted day:2009-08-20
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