Invention Grant
US08043721B2 Method of making multilayer structures using tapes on non-densifying substrates
有权
使用非致密基材上的带制造多层结构的方法
- Patent Title: Method of making multilayer structures using tapes on non-densifying substrates
- Patent Title (中): 使用非致密基材上的带制造多层结构的方法
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Application No.: US12464980Application Date: 2009-05-13
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Publication No.: US08043721B2Publication Date: 2011-10-25
- Inventor: Chandrashekhar S. Khadilkar , Srinivasan Sridharan , Aziz S. Shaikh
- Applicant: Chandrashekhar S. Khadilkar , Srinivasan Sridharan , Aziz S. Shaikh
- Applicant Address: US OH Cleveland
- Assignee: Ferro Corporatiom
- Current Assignee: Ferro Corporatiom
- Current Assignee Address: US OH Cleveland
- Agency: Rankin, Hill & Clark LLP
- Main IPC: B32B19/00
- IPC: B32B19/00

Abstract:
A method of applying a ceramic coating to a substrate comprises laminating one or more layers of a green ceramic tape to a rigid substrate using a tackifying resin to adhere the tape to the substrate. Upon firing, the tackifying resin ensures near zero shrinkage of the tape in the XY plane without usage of elevated pressures or temperatures during lamination of green tape to the substrate. The thermal degradation completion temperature of the tackifying resin is lower than that of the resin binder used in the green tape.
Public/Granted literature
- US20090220799A1 Method Of Making Multilayer Structures Using Tapes On Non-Densifying Substrates Public/Granted day:2009-09-03
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