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发明授权
US08044117B2 Latent hardener, process for producing the same, and adhesive containing latent hardener 有权
潜在硬化剂，其制造方法和含有潜在硬化剂的粘合剂

Latent hardener, process for producing the same, and adhesive containing latent hardener
摘要：
A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.
摘要（中）：

本发明的潜在性固化剂（30）包括芯部件（31）和覆盖在芯部件（31）的表面上的胶囊（37）。 芯构件（31）包括保留在二次颗粒（32）的间隙（38）中的二次颗粒（32）和固化剂（35）。 固化剂（35）在环境温度下为液体。 当胶囊（37）被破坏使得固化剂（35）被发射到粘合剂中时，固化剂（35）与粘合剂中的其它成分混合。 在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂（35），同时将硅烷偶联剂加入到粘合剂中。 在固化剂（35）和硅烷偶联剂之间发生反应以产生阳离子。 通过这些阳离子，环氧树脂在聚合中经历阳离子。 由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行，所以在常规粘合剂的情况下，固化进行得更快且温度更低。

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