Invention Grant
- Patent Title: Multi-direction wedge clamp
- Patent Title (中): 多向楔形夹
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Application No.: US12178088Application Date: 2008-07-23
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Publication No.: US08045332B2Publication Date: 2011-10-25
- Inventor: Ying-Ming Lee , Matthew Neil , Neal Knoblock
- Applicant: Ying-Ming Lee , Matthew Neil , Neal Knoblock
- Applicant Address: US FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: US FL Melbourne
- Agency: Fox Rothschild, LLP
- Agent Robert J. Sacco
- Main IPC: H05K5/00
- IPC: H05K5/00

Abstract:
A circuit card clamp (300) including a base member (316), at least one first wedge member (446), and a thermally conductive membrane (350). The base member has an elongated shape configured for insertion in a circuit card chassis slot (106). The first wedge member is movable relative to the base member in response to a first actuator (304) for engaging the circuit card chassis slot. The thermally conductive membrane is coupled to the base member and the first wedge member. The thermally conductive membrane has slack for permitting the first wedge member to move relative to the base member between a first clamped position and a second unclamped position. The thermally conductive membrane defines a thermal conductive path (206) between a circuit card (104) and the chassis slot for releasably securing a circuit card in the circuit card chassis slot.
Public/Granted literature
- US20100020514A1 MULTI-DIRECTION WEDGE CLAMP Public/Granted day:2010-01-28
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