Invention Grant
- Patent Title: Component adapted for being mounted on a substrate and a method of mounting a surface mounted device
- Patent Title (中): 适于安装在基板上的部件和安装表面安装装置的方法
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Application No.: US12090884Application Date: 2006-10-13
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Publication No.: US08045334B2Publication Date: 2011-10-25
- Inventor: Maurice Alexander Hugo Donners
- Applicant: Maurice Alexander Hugo Donners
- Applicant Address: NL Eindhoven
- Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee: Koninklijke Philips Electronics N.V.
- Current Assignee Address: NL Eindhoven
- Priority: EP05109811 20051021
- International Application: PCT/IB2006/053768 WO 20061013
- International Announcement: WO2007/046045 WO 20070426
- Main IPC: H05K7/00
- IPC: H05K7/00 ; H05K7/10 ; H05K1/03

Abstract:
A supporting component (1) adapted for being mounted on a substrate (11) and for serving as a support for a surface mounted device (15) comprises a body (2) having a first surface (3) adapted for being mounted on the substrate (11), and a second surface (4) being adapted for supporting the surface mounted device (15). The second surface (4) is inclined in relation to the first surface (3). The supporting component (1) further comprises a first supporting component conductor (6) adapted for forming an electrical contact between a first substrate conductor (12) of the substrate (11) and a first electrode (16) of the surface mounted device (15). In a method of mounting a surface mounted device (15) in an inclined manner on a substrate (11) the supporting component (1) is mounted on the substrate (11) with the surface mounted device (15) on top of it.
Public/Granted literature
- US20080314624A1 Component Adapted for Being Mounted on a Substrate and a Method of Mounting a Surface Mounted Device Public/Granted day:2008-12-25
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