Invention Grant
- Patent Title: Electronic apparatus and jig system
- Patent Title (中): 电子仪器和夹具系统
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Application No.: US12399616Application Date: 2009-03-06
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Publication No.: US08045704B2Publication Date: 2011-10-25
- Inventor: Tetsuo Okazaki , Manabu Yamazaki , Shinichi Kido , Kazuhiro Nakashima
- Applicant: Tetsuo Okazaki , Manabu Yamazaki , Shinichi Kido , Kazuhiro Nakashima
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Toshiba Mobile Communications Limited
- Current Assignee: Fujitsu Toshiba Mobile Communications Limited
- Current Assignee Address: JP Kawasaki
- Agency: Maschoff Gilmore & Israelsen
- Priority: JPP2008-208603 20080813
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H04M9/00

Abstract:
According to an aspect of the invention, an electronic apparatus including: an outer case; an inner case corresponding to the outer case; an engagement nail having a first nail face directed to a first direction from the outer case toward the inner case and a second nail face directed to a second direction from the inner case toward the outer case, the engagement nail being extend from the outer case; and a resilient wire disposed on a certain position on the inner case along an edge of the inner case, the certain position corresponding to the engagement nail, wherein, at a first state, the resilient wire is movable in a third direction from the edge toward the resilient wire by the first nail face pushing the resilient wire, and wherein, at a second state, the resilient wire is movable in a fourth direction from the resilient wire toward the edge to run on the second nail face.
Public/Granted literature
- US20100037432A1 ELECTRONIC APPARATUS AND JIG SYSTEM Public/Granted day:2010-02-18
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