Invention Grant
- Patent Title: Cable pathway system
- Patent Title (中): 电缆通道系统
-
Application No.: US11924800Application Date: 2007-10-26
-
Publication No.: US08047474B2Publication Date: 2011-11-01
- Inventor: Scott M Lesniak , Dennis J Waszak , Robert Nicoli , David R. Davis
- Applicant: Scott M Lesniak , Dennis J Waszak , Robert Nicoli , David R. Davis
- Applicant Address: US IL Tinley Park
- Assignee: Panduit Corp.
- Current Assignee: Panduit Corp.
- Current Assignee Address: US IL Tinley Park
- Agent Robert A. McCann; Christopher S. Clancy; James H. Williams
- Main IPC: F16L3/22
- IPC: F16L3/22

Abstract:
A cable pathway system has a base with a bottom, a generally planar top surface, a first side, and a second side. The base is configured to be secured to an electronic equipment enclosure and also has an aperture formed therein and a wall positioned adjacent to the aperture. The wall has a curved surface that extends from the top surface to the bottom. A first sidewall extends from the top surface along the first side and extends generally perpendicular to the top surface and substantially along the length of the first side. A second sidewall also extends from the top surface along the second side and extends generally perpendicular to the top surface and substantially along the length of the second side.
Public/Granted literature
- US20090108145A1 Cable Pathway System Public/Granted day:2009-04-30
Information query