Invention Grant
- Patent Title: Assembled fan frame
- Patent Title (中): 组装风扇框架
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Application No.: US12396633Application Date: 2009-03-03
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Publication No.: US08047780B2Publication Date: 2011-11-01
- Inventor: Hung-Jen Chen , Hung-Jung Hsia
- Applicant: Hung-Jen Chen , Hung-Jung Hsia
- Applicant Address: TW Taipei
- Assignee: Inventec Corporation
- Current Assignee: Inventec Corporation
- Current Assignee Address: TW Taipei
- Agency: J.C. Patents
- Priority: CN200810176810 20081121
- Main IPC: F03D5/00
- IPC: F03D5/00

Abstract:
An assembled fan frame suitable for a case body includes a framework, a plurality of first assemblies, a back slab, and a plurality of second assemblies. The framework includes a fixing slab, a first side wall and a second side wall facing each other, and an accommodation space is defined to accommodate at least one fan module. The fixing slab has at least one first vent and a plurality of first assembling holes which are disposed around the first vent. The first assembly is disposed through the first assembling hole and fastens the fan module on the fixing slab. The back slab is vertically mounted on a surface of the case body and faces the fixing slab. The back slab includes at least one second vent and a plurality of second assembling holes. The second assembly is disposed through the second assembling hole and detachably fixes the framework on the back slab.
Public/Granted literature
- US20100129208A1 ASSEMBLED FAN FRAME Public/Granted day:2010-05-27
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