发明授权
- 专利标题: Mold fixing system
- 专利标题(中): 模具固定系统
-
申请号: US12449234申请日: 2007-06-26
-
公开(公告)号: US08047826B2公开(公告)日: 2011-11-01
- 发明人: Seiji Kimura
- 申请人: Seiji Kimura
- 申请人地址: JP Hyogo
- 专利权人: Pascal Engineering Corporation
- 当前专利权人: Pascal Engineering Corporation
- 当前专利权人地址: JP Hyogo
- 代理机构: Jordan and Hamburg LLP
- 优先权: JPPCT/JP2007/053406 20070223
- 国际申请: PCT/JP2007/000692 WO 20070626
- 国际公布: WO2008/105033 WO 20080904
- 主分类号: B29C33/32
- IPC分类号: B29C33/32 ; B29C45/76
摘要:
Each of a plurality of injection molding machines is provided with clamp plates fixed on platens and a plurality of magnet units to generate magnetic force for fixing a mold to the clamp plate fitted on the clamp plates; and the plurality of injection molding machines are provided with a plurality of common connectors having the same structure, each of which is electrically connected to the magnetic unit, a molding machine control unit and a power source device; and the mold fixing system comprises a set of operation control units to be shared by the plurality of injection molding machines, and when a mold is to be exchanged in any of the injection molding machines, the plurality of magnet units are switched to the non-adsorbing state or the adsorbing state via the operation control unit in the state where the operation control unit is connected to the common connector of the injection molding machine.
公开/授权文献
- US20100092587A1 MOLD FIXING SYSTEM 公开/授权日:2010-04-15
信息查询