发明授权
- 专利标题: Polishing apparatus, polishing method, and processing apparatus
- 专利标题(中): 抛光装置,抛光方法和处理装置
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申请号: US12310364申请日: 2007-10-02
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公开(公告)号: US08047896B2公开(公告)日: 2011-11-01
- 发明人: Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
- 申请人: Tamami Takahashi , Kenya Ito , Masaya Seki , Hiroaki Kusa
- 申请人地址: JP Tokyo
- 专利权人: Ebara Corporation
- 当前专利权人: Ebara Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Wenderoth, Lind & Ponack, L.L.P.
- 优先权: JP2006-273331 20061004
- 国际申请: PCT/JP2007/069641 WO 20071002
- 国际公布: WO2008/041778 WO 20080410
- 主分类号: B24B49/00
- IPC分类号: B24B49/00 ; B24B21/20
摘要:
The present invention provides a polishing apparatus and a polishing method capable of calculating outside diameters of rolls of a polishing tape on a polishing-tape supply reel and a polishing-tape recovery reel and capable of calculating a remaining amount of the polishing tape and a consumption of the polishing tape from the outside diameters of the rolls. This polishing apparatus includes a polishing-tape supply reel (46), a polishing head (44), a polishing-tape drawing-out mechanism G1, and a polishing-tape supply and recovery mechanism (45) configured to recover the polishing tape (43) from the polishing-tape supply reel (46) via the polishing head (44). The polishing-tape supply and recovery mechanism (45) includes a motor Mb adapted to apply a torque to the polishing-tape supply reel (46) so as to exert a predetermined tension on the polishing tape (43) traveling through the polishing head (44), and a rotation angle detector REa adapted to detect a rotation angle of the polishing-tape supply reel (46).
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