发明授权
- 专利标题： Structure of embedded active components and manufacturing method thereof
- 专利标题（中）： 嵌入式有源元件的结构及其制造方法
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申请号： US12382526申请日： 2009-03-18
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公开(公告)号： US08048716B2公开(公告)日： 2011-11-01
- 发明人: Shou-Lung Chen , Cheng-Ta Ko
- 申请人： Shou-Lung Chen , Cheng-Ta Ko
- 申请人地址： TW Hsinchu
- 专利权人： Industrial Technology Research Institute
- 当前专利权人： Industrial Technology Research Institute
- 当前专利权人地址： TW Hsinchu
- 代理机构： Morris Manning Martin LLP
- 代理商 Tim Tingkang Xia, Esq.
- 优先权： TW93135743A 20041119
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A structure of embedded active components and the manufacturing method thereof are provided. The manufacturing steps involve providing a molding plate, and setting several active components on the molding plate as first. A dielectric layer covers the molding plate to cap the active components. An electric circuit is formed on the dielectric layer, in contact with the active components. Finally, the structure with embedded active components is released from the molding plate.
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