发明授权
- 专利标题: Ultra wideband system-on-package
- 专利标题(中): 超宽带系统级封装
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申请号: US12604354申请日: 2009-10-22
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公开(公告)号: US08049319B2公开(公告)日: 2011-11-01
- 发明人: In-Kwon Ju , In-Bok Yom , Ho-Jin Lee
- 申请人: In-Kwon Ju , In-Bok Yom , Ho-Jin Lee
- 申请人地址: KR Daejeon
- 专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人: Electronics and Telecommunications Research Institute
- 当前专利权人地址: KR Daejeon
- 优先权: KR10-2008-0104872 20081024; KR10-2008-0131439 20081222
- 主分类号: H01L23/02
- IPC分类号: H01L23/02 ; H01L23/053 ; H01L23/12 ; H01L23/34
摘要:
This research discloses an ultra wideband system-on-package (SoP). The SoP includes a package body; a first integrated circuit mounted on the package body; a first signal transmission unit connected to the first integrated circuit; a signal via connected to the first signal transmission unit and including a slab line and a trough line; and a second signal transmission unit connected to the signal via. The technology of the present research can transmit ultra broadband signals by minimizing discontinuity of signals appearing during vertical transition that occurs in the course of a signal transmission to/from an external circuit, and a fabrication method thereof.