Invention Grant
- Patent Title: Circuit board with embedded components and manufacturing and measuring method thereof
- Patent Title (中): 具有嵌入式元件的电路板及其制造及测量方法
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Application No.: US11882814Application Date: 2007-08-06
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Publication No.: US08049512B2Publication Date: 2011-11-01
- Inventor: Uei-Ming Jow , Min-Lin Lee , Shinn-Juh Lai , Chin-Sun Shyu , Chang-Sheng Chen , Ying-Jiunn Lai
- Applicant: Uei-Ming Jow , Min-Lin Lee , Shinn-Juh Lai , Chin-Sun Shyu , Chang-Sheng Chen , Ying-Jiunn Lai
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Rabin & Berdo, P.C.
- Priority: TW95129262A 20060809
- Main IPC: G01R31/11
- IPC: G01R31/11
Abstract:
A circuit board with embedded components includes a plurality of embedded components and at least one transmission line electrically connected to at least one of the embedded components and having a terminal circuit. Therefore, a measuring device is used to be electrically connected to the transmission line and send out a signal, so as to receive a corresponding reflected signal, and then, compare the received reflected signal with a signal pattern in the database to obtain an electrical parameter of the embedded component.
Public/Granted literature
- US20080035371A1 Circuit board with embedded components and manufacturing and measuring method thereof Public/Granted day:2008-02-14
Information query
