发明授权
US08050047B2 Integrated circuit package system with flexible substrate and recessed package
有权
集成电路封装系统，具有柔性基板和凹槽封装
- 专利标题： Integrated circuit package system with flexible substrate and recessed package
- 专利标题（中）： 集成电路封装系统，具有柔性基板和凹槽封装
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申请号： US12136002申请日： 2008-06-09
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公开(公告)号： US08050047B2公开(公告)日： 2011-11-01
- 发明人: Seng Guan Chow , Il Kwon Shim , Byung Joon Han , Kambhampati Ramakrishna
- 申请人： Seng Guan Chow , Il Kwon Shim , Byung Joon Han , Kambhampati Ramakrishna
- 申请人地址： SG Singapore
- 专利权人： Stats Chippac Ltd.
- 当前专利权人： Stats Chippac Ltd.
- 当前专利权人地址： SG Singapore
- 代理商 Mikio Ishimaru
- 主分类号： H05K1/16
- IPC分类号： H05K1/16 ; H05K1/00 ; H01L23/02
摘要：
An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.