发明授权
- 专利标题: Light emitting device and method for fabricating the same
- 专利标题(中): 发光元件及其制造方法
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申请号: US11267320申请日: 2005-11-07
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公开(公告)号: US08053795B2公开(公告)日: 2011-11-08
- 发明人: Hyun Jae Lee , Jun Seok Ha
- 申请人: Hyun Jae Lee , Jun Seok Ha
- 申请人地址: KR Seoul
- 专利权人: LG Electronic Inc.
- 当前专利权人: LG Electronic Inc.
- 当前专利权人地址: KR Seoul
- 代理机构: McKenna Long & Aldridge LLP
- 优先权: KR10-2004-0090456 20041108
- 主分类号: H01L33/00
- IPC分类号: H01L33/00
摘要:
A light emitting device and a method for fabricating the same according to the present invention are advantageous in that since an LLO (Laser Lift Off) process is performed using a thick metal film grown through a growth process, an occurrence rate of a void is remarkably decreased due to dense bonding between metals so that an occurrence rate of a crack can be decreased. Further, the present invention has an advantage in that a metal is filled in trench regions formed through an isolation process for devices, thereby protecting the devices and ensuring excellent heat dissipation. The present invention has a further advantage in that a reflective film is formed on inclined sidewalls of a device-forming thin film layer so that light loss through lateral sides of the device can be reduced, thereby improving optical properties.