发明授权
- 专利标题： Multi lead frame power package
- 专利标题（中）： 多引线框电源封装
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申请号： US12573196申请日： 2009-10-05
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公开(公告)号： US08053876B2公开(公告)日： 2011-11-08
- 发明人: Steven A Kummerl , Bernhard P Lange , Anthony L Coyle
- 申请人： Steven A Kummerl , Bernhard P Lange , Anthony L Coyle
- 申请人地址： US TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： US TX Dallas
- 代理商 Yingsheng Tung; Wade J. Brady, III; Frederick J. Telecky, Jr.
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/00 ; H05K7/20
摘要：
According to an embodiment of the invention, a system, operable to facilitate dissipation of thermal energy, includes a mold compound, a die, a first lead frame, and a second lead frame. The die is disposed within the mold compound, and in operation generates thermal energy. The first lead frame is disposed at least partially within the mold compound and is operable to facilitate transmission of a signal. The second lead frame is disposed at least partially within the compound, at least partially separated from the first lead frame, and is operable to facilitate a dissipation of thermal energy.
公开/授权文献
- US20100019361A1 Multi Lead Frame Power Package 公开/授权日：2010-01-28
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