利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US08054630B2 Electronic components on trenched substrates and method of forming same 有权
沟槽基片上的电子元件及其形成方法

Electronic components on trenched substrates and method of forming same
摘要：
A method of mounting an electronic component on a substrate includes forming at least one trench in a surface of the substrate. The trenches formed in the substrate reduce a stiffness of the substrate, which provides less resistance to shear. Accordingly, the trenches reduce the amount of strain on the joints, which mount the electronic component to the substrate, which enhances the life of the joints.
摘要（中）：

将电子部件安装在基板上的方法包括在基板的表面中形成至少一个沟槽。 形成在衬底中的沟槽降低了衬底的刚度，这提供了较小的剪切阻力。 因此，沟槽减少了将电子部件安装到基板上的接头上的应变量，这增加了接头的寿命。

公开/授权文献
信息查询
Espacenet
0/0