Invention Grant
- Patent Title: Floor covering, floor panel and method for manufacturing floor panels
- Patent Title (中): 地板,地板和地板的制造方法
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Application No.: US12087665Application Date: 2006-12-27
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Publication No.: US08056295B2Publication Date: 2011-11-15
- Inventor: Mark Cappelle , Bernard Thiers , Luc Vanhastel
- Applicant: Mark Cappelle , Bernard Thiers , Luc Vanhastel
- Applicant Address: LU Bertrange
- Assignee: Flooring Industries Limited, SARL
- Current Assignee: Flooring Industries Limited, SARL
- Current Assignee Address: LU Bertrange
- Agency: Bacon & Thomas, PLLC
- Priority: BE2006/0029 20060112
- International Application: PCT/IB2006/003808 WO 20061227
- International Announcement: WO2007/080449 WO 20070719
- Main IPC: E04B5/17
- IPC: E04B5/17 ; E04B5/32

Abstract:
Floor covering, consisting of floor panels (2), which, at least at two opposite sides (3-4), comprise coupling parts (5-6), which, in the coupled condition of two of such floor panels (2), provide for a vertical as well as for a horizontal locking, characterized in that in coupled condition, at least at the location of the aforementioned two sides (3-4) of at least two mutually coupled floor panels (2), a strip (11), more particularly a prefabricated strip (11), is present in the floor covering (1), said strip extending up to the visible side of the floor covering (1).
Public/Granted literature
- US20090000232A1 Floor Covering, Floor Panel and Method For Manufacturing Floor Panels Public/Granted day:2009-01-01
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