Invention Grant
- Patent Title: Pin bending device
- Patent Title (中): 针弯曲装置
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Application No.: US12177835Application Date: 2008-07-22
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Publication No.: US08056386B2Publication Date: 2011-11-15
- Inventor: Chun-Nan Ou , Bin Wang , Cheng-Bin Su , Jian-Long Xing , Ga-Lei Hu
- Applicant: Chun-Nan Ou , Bin Wang , Cheng-Bin Su , Jian-Long Xing , Ga-Lei Hu
- Applicant Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen, Guangdong Province TW Tu-Cheng, New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200810301366 20080428
- Main IPC: B21D9/14
- IPC: B21D9/14 ; B21F45/00

Abstract:
An exemplary pin bending device (200) includes a base (210), a sliding member (230), a fixing member (240), and a latch member (250). The sliding member (230) is slidably positioned on the base and defines a plurality of holes (2303) for receiving first portions of pins. The fixing member is fixed on the base. The latch member is movably positioned on the base. The latch member is able to move towards the fixing member in a direction perpendicular to the sliding direction of the sliding member and engage with the fixing member to fix second portions of the pins.
Public/Granted literature
- US20090266136A1 PIN BENDING DEVICE Public/Granted day:2009-10-29
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