发明授权
- 专利标题： Micro-passage chip
- 专利标题（中）： 微通道芯片
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申请号： US12664621申请日： 2008-06-13
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公开(公告)号： US08057743B2公开(公告)日： 2011-11-15
- 发明人: Kiyoshi Nokihara , Yasuo Oka
- 申请人： Kiyoshi Nokihara , Yasuo Oka
- 申请人地址： JP Kyoto-shi JP Tokyo
- 专利权人： Hipep Laboratories,Nippon Light Metal Company, Ltd.
- 当前专利权人： Hipep Laboratories,Nippon Light Metal Company, Ltd.
- 当前专利权人地址： JP Kyoto-shi JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP2007-158228 20070615
- 国际申请： PCT/JP2008/060828 WO 20080613
- 国际公布： WO2008/153119 WO 20081218
- 主分类号： B01J19/00
- IPC分类号： B01J19/00 ; B01J8/02 ; B01J35/02 ; B01J8/00 ; B01J10/00
摘要：
Means for overcoming the problems which the conventional glass microchannel chips have are disclosed. That is, a microchannel chip in which microchannels can be formed at a low cost, and which has a high chemical resistance is disclosed. The microchannel chip is constituted by a substrate made of carbon, which has a channel in its surface; and a cover composed of a glass plate bonded to the substrate. The cover is bonded to the substrate by heating at least a part of the contact surface at which the substrate is in contact with the cover.
公开/授权文献
- US20100178222A1 MICRO-PASSAGE CHIP 公开/授权日：2010-07-15
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