利索-全球专利检索

  1. 登录
  2. 注册
发明授权
US08058099B2 Method of fabricating a two-sided die in a four-sided leadframe based package 有权
在四面引线框架封装中制造双面裸片的方法

Method of fabricating a two-sided die in a four-sided leadframe based package
摘要：
A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. In embodiments, a semiconductor die having die bond pads along two adjacent edges may be electrically coupled to four sides of a four-sided leadframe. Embodiments relate to lead and no-lead type leadframe.
摘要（中）：

公开了一种制造基于引线框的半导体封装的方法以及由此形成的半导体封装。 在实施例中，具有沿两个相邻边缘的管芯接合焊盘的半导体管芯可以电耦合到四面引线框架的四个侧面。 实施例涉及引线和无引线型引线框架。

公开/授权文献
信息查询
Espacenet
0/0