发明授权
- 专利标题： Holistic thermal management system for a semiconductor chip
- 专利标题（中）： 半导体芯片整体热管理系统
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申请号： US11948124申请日： 2007-11-30
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公开(公告)号： US08058724B2公开(公告)日： 2011-11-15
- 发明人: Gamal Refai-Ahmed
- 申请人： Gamal Refai-Ahmed
- 申请人地址： CA Markham
- 专利权人： ATI Technologies ULC
- 当前专利权人： ATI Technologies ULC
- 当前专利权人地址： CA Markham
- 代理商 Timothy M. Honeycutt
- 主分类号： H01L23/373
- IPC分类号： H01L23/373
摘要：
Various semiconductor chip thermal management systems and methods are disclosed. In one aspect, a method of manufacturing is provided that includes coupling a semiconductor chip to a substrate and coupling a diamond heat spreader that has a thermoelectric cooler to the semiconductor chip. A vapor chamber is coupled to the diamond heat spreader.
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