Invention Grant
US08060352B2 Geospatial modeling system using void filling and related methods
有权
地空间建模系统采用空隙填充及相关方法
- Patent Title: Geospatial modeling system using void filling and related methods
- Patent Title (中): 地空间建模系统采用空隙填充及相关方法
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Application No.: US11874299Application Date: 2007-10-18
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Publication No.: US08060352B2Publication Date: 2011-11-15
- Inventor: Patrick Kelley , Mark Rahmes , Harlan Yates , Josef De Vaughn Allen , Eric Spellman
- Applicant: Patrick Kelley , Mark Rahmes , Harlan Yates , Josef De Vaughn Allen , Eric Spellman
- Applicant Address: US FL Melbourne
- Assignee: Harris Corporation
- Current Assignee: Harris Corporation
- Current Assignee Address: US FL Melbourne
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Main IPC: G06G7/48
- IPC: G06G7/48 ; G06K9/00

Abstract:
A geospatial modeling system may include a geospatial model data storage device and a processor cooperating therewith for determining a void within a geospatial model data set defining a void boundary region, and selecting at least one raw fill region from within the geospatial model data set for filling the void. The processor may also cooperate with the geospatial model data storage device for adjusting elevation values of the at least one raw fill region based upon elevation differences between corresponding portions of the void boundary region and the at least one raw fill region, and updating the geospatial model based upon the adjusted elevation values of the at least one raw fill region.
Public/Granted literature
- US20090106000A1 GEOSPATIAL MODELING SYSTEM USING VOID FILLING AND RELATED METHODS Public/Granted day:2009-04-23
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