A rotatable abrasive lapper machine platen assembly is attached to a lapper machine frame. The assembly has at least: a) a circular-shaped rotatable horizontal platen having i) a front surface and ii) a back surface; b) the circular platen having a platen radius, a platen outer circumference and a platen outer periphery; c) the circular platen front surface having an outer annular planar portion where the platen outer annular planar portion extends radially to the circular platen outer circumference; and d) a flexible abrasive disk secured in conformable flat contact with the circular platen front surface outer annular planar portion wherein the abrasive disk is positioned concentric with the circular platen.