Disclosed in this specification is a buck converter package with stacked dice and a process for forming a buck converter. The package includes a die attach pad with a low side die mounted on one surface and a high side die mounted on the opposing surface. The die attach pad is conductive, such that the drain of the low side die is connected to the source of the high side die through the pad. A controller die controls the gates of the high and low side dies. A plurality of leads extends outside of the package to permit electrical connections to the inside of the package. The high side drain is exposed to one of the surfaces of the package.