Invention Grant
- Patent Title: Electronics package with integrated lugs for cooling attachment
- Patent Title (中): 电子封装,带集成接头用于冷却附件
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Application No.: US12163531Application Date: 2008-06-27
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Publication No.: US08063485B1Publication Date: 2011-11-22
- Inventor: Kaveh Azar
- Applicant: Kaveh Azar
- Applicant Address: US MA Norwood
- Assignee: Advanced Thermal Solutions, Inc.
- Current Assignee: Advanced Thermal Solutions, Inc.
- Current Assignee Address: US MA Norwood
- Agency: Lieberman & Brandsdorfer, LLC
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.
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