Invention Grant
US08063485B1 Electronics package with integrated lugs for cooling attachment 有权
电子封装,带集成接头用于冷却附件

Electronics package with integrated lugs for cooling attachment
Abstract:
A board mounted integrated electronics package assembly is provided with one or more securing elements to attach a heat dissipating device directly to the package. The securing element(s) is located along a periphery of the package and anchors a base of the heat dissipating device to the package, thereby eliminating employment of a secondary heat dissipating material between the package and the heat dissipating device.
Information query
Patent Agency Ranking
0/0