发明授权
- 专利标题: Via structure of printed circuit board
- 专利标题(中): 通过印刷电路板的结构
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申请号: US11927710申请日: 2007-10-30
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公开(公告)号: US08067700B2公开(公告)日: 2011-11-29
- 发明人: Yu-Chang Pai , Shou-Kuo Hsu , Chien-Hung Liu
- 申请人: Yu-Chang Pai , Shou-Kuo Hsu , Chien-Hung Liu
- 申请人地址: TW Tu-Cheng, New Taipei
- 专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人: Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址: TW Tu-Cheng, New Taipei
- 代理机构: Altis Law Group, Inc.
- 优先权: CN200710200391 20070404
- 主分类号: H05K1/11
- IPC分类号: H05K1/11
摘要:
A printed circuit board (200) includes at least one via (280) defined therein, the via has an upper cap (220) formed on a top surface of the PCB, and a lower cap (240) formed on a bottom surface of the PCB. A conductive hole (290) is defined in the PCB having a plated sidewall (230) plated on its inner surface, and a first clearance hole (271) is defined in a first inner layer (260) of the PCB around the sidewall. A first transmission line (210) defined on the top surface of the PCB is coupled to the upper cap, a first void (273) extending from a boundary of the first clearance hole being disposed along the layout direction of the first transmission line.
公开/授权文献
- US20080245558A1 VIA STRUCTURE OF PRINTED CIRCUIT BOARD 公开/授权日:2008-10-09
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