发明授权
- 专利标题: Temperature compensation circuit and method
- 专利标题(中): 温度补偿电路及方法
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申请号: US12134323申请日: 2008-06-06
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公开(公告)号: US08067992B2公开(公告)日: 2011-11-29
- 发明人: Alex Jianzhong Chen , Gim Eng Chew , Tong Tee Tan , Kok Chin Pan
- 申请人: Alex Jianzhong Chen , Gim Eng Chew , Tong Tee Tan , Kok Chin Pan
- 申请人地址: SG Singapore
- 专利权人: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- 当前专利权人: Avago Technologies ECBU IP (Singapore) Pte. Ltd.
- 当前专利权人地址: SG Singapore
- 主分类号: H03K3/26
- IPC分类号: H03K3/26
摘要:
Disclosed are various embodiments of temperature-compensated relaxation oscillator circuits that may be fabricated using conventional CMOS manufacturing techniques. The relaxation oscillator circuits described herein exhibit superior low temperature coefficient performance characteristics, and do not require the use of expensive off-chip high precision resistors to effect temperature compensation. Positive and negative temperature coefficient resistors arranged in a resistor array offset one another to provide temperature compensation in the relaxation oscillator circuit.
公开/授权文献
- US20090302954A1 Temperature Compensation Circuit and Method 公开/授权日:2009-12-10
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