发明授权
- 专利标题: Wafer electroless plating system and associated methods
- 专利标题(中): 晶圆化学镀系统及相关方法
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申请号: US11735984申请日: 2007-04-16
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公开(公告)号: US08069813B2公开(公告)日: 2011-12-06
- 发明人: William Thie , John M. Boyd , Fritz C. Redeker , Yezdi Dordi , John Parks , Tiruchirapalli Arunagiri , Aleksander Owczarz , Todd Balisky , Clint Thomas , Jacob Wylie , Alan M. Schoepp
- 申请人: William Thie , John M. Boyd , Fritz C. Redeker , Yezdi Dordi , John Parks , Tiruchirapalli Arunagiri , Aleksander Owczarz , Todd Balisky , Clint Thomas , Jacob Wylie , Alan M. Schoepp
- 申请人地址: US CA Fremont
- 专利权人: Lam Research Corporation
- 当前专利权人: Lam Research Corporation
- 当前专利权人地址: US CA Fremont
- 代理机构: Martine Penilla Group, LLP
- 主分类号: B05C3/00
- IPC分类号: B05C3/00
摘要:
A dry-in/dry-out system is disclosed for wafer electroless plating. The system includes an upper zone for wafer ingress/egress and drying operations. Proximity heads are provided in the upper zone to perform the drying operations. The system also includes a lower zone for electroless plating operations. The lower zone includes an electroless plating apparatus that implements a wafer submersion by fluid upwelling method. The upper and lower zones of the system are enclosed by a dual-walled chamber, wherein the inner wall is a chemically inert plastic and the outer wall is a structural metal. The system interfaces with a fluid handling system which provides the necessary chemistry supply and control for the system. The system is ambient controlled. Also, the system interfaces with an ambient controlled managed transfer module (MTM).
公开/授权文献
- US20080254621A1 Wafer Electroless Plating System and Associated Methods 公开/授权日:2008-10-16