发明授权
US08070048B2 Method of attaching a solder ball and method of repairing a memory module
有权
连接焊球的方法和修复存储器模块的方法
- 专利标题： Method of attaching a solder ball and method of repairing a memory module
- 专利标题（中）： 连接焊球的方法和修复存储器模块的方法
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申请号： US12881439申请日： 2010-09-14
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公开(公告)号： US08070048B2公开(公告)日： 2011-12-06
- 发明人: Nam-Yong Oh , Seong-Chan Han , Jae-Young Kim , Jae-Hoon Choi
- 申请人： Nam-Yong Oh , Seong-Chan Han , Jae-Young Kim , Jae-Hoon Choi
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Stanzione & Kim, LLP
- 优先权： KR2009-90006 20090923
- 主分类号： B23K1/00
- IPC分类号： B23K1/00
摘要：
In a method of attaching a solder ball, a first material is coated on a solder ball. A second material is coated on a pad of a substrate where the solder ball is to be attached to exothermically react with the first material. The solder ball makes contact with the pad such that the first material and the second material exothermically react with each other to release heat to adhere the solder ball to the pad using the heat.